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PH3075L
N-channel TrenchMOSTM logic level FET
Rev. 01 -- 25 February 2005 Product data sheet
1. Product profile
1.1 General description
Logic level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using TrenchMOSTM technology.
1.2 Features
s Logic level threshold s 175 C rated s Very low on-state resistance s Surface mounted package.
1.3 Applications
s DC-to-DC converters s DC motor speed control. s General purpose power switching
1.4 Quick reference data
s VDS 75 V s RDSon 28 m s ID 30 A s Qgd = 9 nC (typ).
2. Pinning information
Table 1: Pin 1, 2, 3 4 mb Pinning Description source gate mounting base; connected to drain
mb
D
Simplified outline
Symbol
G
mbb076
S
1234
SOT669 (LFPAK)
Philips Semiconductors
PH3075L
N-channel TrenchMOSTM logic level FET
3. Ordering information
Table 2: Ordering information Package Name PH3075L LFPAK Description plastic single-ended surface mounted package; 4 leads Version SOT669 Type number
4. Limiting values
Table 3: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDS VDGR VGS ID IDM Ptot Tstg Tj IS ISM drain-source voltage (DC) drain-gate voltage (DC) gate-source voltage (DC) drain current (DC) peak drain current total power dissipation storage temperature junction temperature source (diode forward) current (DC) Tmb = 25 C peak source (diode forward) current Tmb = 25 C; pulsed; tp 10 s unclamped inductive load; ID = 30 A; VDD 75 V; RGS = 50 ; VGS = 10 V starting at Tj = 25 C unclamped inductive load; ID = 3 A; VDD 75 V; RGS = 50 ; VGS = 10 V
[1] [2]
Conditions 25 C Tj 175 C 25 C Tj 175 C; RGS = 20 k Tmb = 25 C; VGS = 5 V; Figure 2 and 3 Tmb = 100 C; VGS = 5 V; Figure 2 Tmb = 25 C; pulsed; tp 10 s; Figure 3 Tmb = 25 C; Figure 1
Min -55 -55 -
Max 75 75 15 30 21 120 75 +175 +175 30 120 89
Unit V V V A A A W C C A A mJ
Source-drain diode
Avalanche ruggedness EDS(AL)S non-repetitive drain-source avalanche energy EDS(AL)R repetitive drain-source avalanche energy
[1] [2]
-
0.89
mJ
Duty cycle is limited by the maximum junction temperature. Repetitive avalanche failure is not determined simply by thermal effects. Repetitive avalanche transients should only be applied for short bursts, not every switching cycle.
9397 750 14603
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 25 February 2005
2 of 12
Philips Semiconductors
PH3075L
N-channel TrenchMOSTM logic level FET
120 Pder (%) 80
03aa16
120 Ider (%) 80
03aa24
40
40
0 0 50 100 150 Tmb (C) 200
0
0
50
100
150
200 Tmb (C)
P tot P der = ---------------------- x 100 % P
tot ( 25 C)
ID I der = ------------------- x 100 % I
D ( 25 C)
Fig 1. Normalized total power dissipation as a function of mounting base temperature
Fig 2. Normalized continuous drain current as a function of mounting base temperature
103 ID (A) Limit RDSon = VDS / ID 102 tp = 10 s 100 s 10 1 ms DC 1 1 10 10 ms 100 ms 102 VDS (V)
003aaa699
103
Tmb = 25 C; IDM is single pulse
Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage
9397 750 14603
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 25 February 2005
3 of 12
Philips Semiconductors
PH3075L
N-channel TrenchMOSTM logic level FET
5. Thermal characteristics
Table 4: Rth(j-mb) Thermal characteristics Conditions Min Typ Max 2 Unit K/W thermal resistance from junction to mounting base Figure 4 Symbol Parameter
10 Zth(j-mb) (K/W) 1 = 0.5 0.2 0.1 0.05 10-1 0.02 P
003aaa700
=
tp T
tp single shot 10
-2
t T
10-6
10-5
10-4
10-3
10-2
10-1
tp (s)
1
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration
9397 750 14603
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 25 February 2005
4 of 12
Philips Semiconductors
PH3075L
N-channel TrenchMOSTM logic level FET
6. Characteristics
Table 5: Characteristics Tj = 25 C unless otherwise specified. Symbol V(BR)DSS Parameter drain-source breakdown voltage Conditions ID = 250 A; VGS = 0 V Tj = 25 C Tj = -55 C VGS(th) gate-source threshold voltage ID = 1 mA; VDS = VGS; Figure 9 and 10 Tj = 25 C Tj = 175 C Tj = -55 C IDSS drain-source leakage current VDS = 75 V; VGS = 0 V Tj = 25 C Tj = 175 C IGSS RDSon gate-source leakage current drain-source on-state resistance VGS = 15 V; VDS = 0 V VGS = 5 V; ID = 15 A; Figure 6 and 8 Tj = 25 C Tj = 175 C VGS = 4.5 V; ID = 15 A; Figure 6 and 8 VGS = 10 V; ID = 15 A; Figure 6 and 8 Dynamic characteristics Qg(tot) Qgs Qgd Ciss Coss Crss td(on) tr td(off) tf VSD trr Qr total gate charge gate-source charge gate-drain (Miller) charge input capacitance output capacitance reverse transfer capacitance turn-on delay time rise time turn-off delay time fall time source-drain (diode forward) voltage IS = 15 A; VGS = 0 V; Figure 13 reverse recovery time recovered charge IS = 20 A; dIS/dt = -100 A/s; VGS = -10 V; VR = 30 V VDD = 30 V; RL = 1.2 ; VGS = 5 V; RG = 10 VGS = 0 V; VDS = 25 V; f = 1 MHz; Figure 12 ID = 25 A; VDD = 60 V; VGS = 5 V; Figure 11 19 5 9 150 60 16 106 51 83 0.85 100 115 179 80 1.2 nC nC nC pF pF ns ns ns ns V ns nC 25 23 30 72 34 28 m m m m 2 1 500 100 A A nA 1 0.5 1.5 2 2.3 V V V 75 70 V V Min Typ Max Unit Static characteristics
1550 2070 pF
Source-drain diode
9397 750 14603
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 25 February 2005
5 of 12
Philips Semiconductors
PH3075L
N-channel TrenchMOSTM logic level FET
100 ID (A) 75 Label = VGS (V) 10 7 5
003aaa701
60 RDSon (m) 50 3.4 3.6
003aaa703
3.8 4 5 10
4.2 4 50 3.8 3.6 30 3.4 25 3.2 3 2.8 2.6 0 2 4 6 8 VDS (V) 10 10 0 20 Label is VGS (V) 20 40 60 ID (A) 80 40
0
Tj = 25 C
Tj = 25 C
Fig 5. Output characteristics: drain current as a function of drain-source voltage; typical values
003aaa702
Fig 6. Drain-source on-state resistance as a function of drain current; typical values
003aaa704
60 ID (A) 40
3
a
2
20
1
Tj = 175 C 0 0 1 2
Tj = 25 C 3 4 VGS (V) 5 0 -60 0 60 120 Tj (C) 180
Tj = 25 C and 175 C; VDS > ID x RDSon
R DSon a = ---------------------------R DSon ( 25 C) Fig 8. Normalized drain-source on-state resistance factor as a function of junction temperature
Fig 7. Transfer characteristics: drain current as a function of gate-source voltage; typical values
9397 750 14603
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 25 February 2005
6 of 12
Philips Semiconductors
PH3075L
N-channel TrenchMOSTM logic level FET
2.5 VGS(th) (V) 2 max
03aa33
10-1 ID (A) 10-2
03aa36
1.5
typ
10-3 min typ max
1
min
10-4
0.5
10-5
0 -60
10-6 0 60 120 Tj (C) 180 0 1 2 VGS (V) 3
ID = 1 mA; VDS = VGS
Tj = 25 C; VDS = VGS
Fig 9. Gate-source threshold voltage as a function of junction temperature
003aaa707
Fig 10. Sub-threshold drain current as a function of gate-source voltage
003aaa705
5 VGS (V) 4 VDD = 14 V VDD = 60 V
2500 C (pF) 2000
Ciss
3
1500 Coss
2
1000 Crss
1
500
0
0
5
10
15 QG (nC)
20
0 -1 10
1
10
VDS (V)
102
ID = 25 A; VDD = 14 V and 60 V
VGS = 0 V; f = 1 MHz
Fig 11. Gate-source voltage as a function of gate charge; typical values
Fig 12. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values
9397 750 14603
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 25 February 2005
7 of 12
Philips Semiconductors
PH3075L
N-channel TrenchMOSTM logic level FET
100 IS (A) 75
003aaa706
50
25 Tj = 175 C Tj = 25 C
0 0
0.3
0.6
0.9 VSD (V)
1.2
Tj = 25 C and 175 C; VGS = 0 V
Fig 13. Source (diode forward) current as a function of source-drain (diode forward) voltage; typical value
9397 750 14603
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 25 February 2005
8 of 12
Philips Semiconductors
PH3075L
N-channel TrenchMOSTM logic level FET
7. Package outline
Plastic single-ended surface mounted package (LFPAK); 4 leads SOT669
E b2 L1
A c2
A2
C E1 b3
mounting base D1 H D
b4
L2
1
e
2
3
b
1/2 e
4
wM A c X
A A1 C
(A 3)
detail X L yC 0 2.5 scale 5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A A1 A2 A3 b b2 b3 2.2 2.0 b4 0.9 0.7 c c2 D (1) D1(1) E(1) E1(1) max 5.0 4.8 3.3 3.1 e 1.27 H 6.2 5.8 L 0.85 0.40 L1 1.3 0.8 L2 1.3 0.8 w 0.25 y 0.1 8 0
1.20 0.15 1.10 0.50 4.41 0.25 1.01 0.00 0.95 0.35 3.62
0.25 0.30 4.10 4.20 0.19 0.24 3.80
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT669 REFERENCES IEC JEDEC MO-235 JEITA EUROPEAN PROJECTION ISSUE DATE 03-09-15 04-10-13
Fig 14. Package outline SOT669 (LFPAK)
9397 750 14603 (c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 25 February 2005
9 of 12
Philips Semiconductors
PH3075L
N-channel TrenchMOSTM logic level FET
8. Revision history
Table 6: Revision history Release date 20050225 Data sheet status Product data sheet Change notice Doc. number 9397 750 14603 Supersedes Document ID PH3075L_1
9397 750 14603
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 25 February 2005
10 of 12
Philips Semiconductors
PH3075L
N-channel TrenchMOSTM logic level FET
9. Data sheet status
Level I II Data sheet status [1] Objective data Preliminary data Product status [2] [3] Development Qualification Definition This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
III
Product data
Production
[1] [2] [3]
Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
10. Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
12. Trademarks
TrenchMOS -- is a trademark of Koninklijke Philips Electronics N.V.
11. Disclaimers
Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors
13. Contact information
For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
9397 750 14603
(c) Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 -- 25 February 2005
11 of 12
Philips Semiconductors
PH3075L
N-channel TrenchMOSTM logic level FET
14. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information . . . . . . . . . . . . . . . . . . . . 11
(c) Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 25 February 2005 Document number: 9397 750 14603
Published in The Netherlands

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